Samsung Electronics (005930) completed internal quality verification of the 6th generation high bandwidth memory (HBM4) and completed full-scale mass production preparations. It has secured technical stability that enables immediate production beyond the product development stage. The plan is to preempt the next-generation AI memory market with the goal of final customer approval in early 2026.
According to the semiconductor industry on the 3rd, Samsung Electronics completed the HBM4 production preparation approval (PRA) on the 2nd. PRA is the final gateway to in-house quality assessment prior to product shipment. Passing this stage means that yield and performance have met mass production standards.
The technical perfection has also been further enhanced. Samsung Electronics combined a 10-nanometer-class 6th generation (1c) DRAM core die with a logic die using a 4-nm foundry process. The data processing speed was estimated to have secured a competitive advantage by achieving a data processing speed of 11 gigabits (Gb) or more per second.
Samsung Electronics is currently providing samples to major big tech companies such as NVIDIA and Google and conducting due diligence work. The industry believes that Samsung Electronics will successfully pass the final quality verification (quality test) in early 2026. Samsung Electronics plans to respond to rapidly increasing market demand in the future by expanding production capacity around the Pyeongtaek P4 line.