A Busan-based deep tech startup is targeting the global market by showcasing next-generation AI semiconductor packaging materials at the world's largest mobile communications exhibition.
According to the Busan Creative Economy Innovation Center on March 3, portfolio company CIT participated in Mobile World Congress 2026 (MWC 2026), which opened on March 2 (local time) in Barcelona, Spain, and publicly exhibited its ultra-flat copper-deposited glass substrate for AI semiconductor packaging, "CuFlat-PKGCore."
CIT is a startup developing advanced materials for next-generation telecommunications and semiconductors based on metal single-crystal material technology. Through its proprietary process technology "ASE (Atomic Sputtering Epitaxy)," which deposits and bonds copper atoms layer by layer at the atomic level onto insulating surfaces that do not conduct electricity, the company has stably achieved an "ultra-flat copper structure on glass" that was difficult to realize with conventional processes.
This technology has completed academic verification through publication in the world-renowned journal Nature and the authoritative materials science journal Advanced Materials.
The exhibited product "CuFlat-PKGCore" applies ASE technology to glass substrates for semiconductor packages, featuring an ultra-flat structure with copper surface roughness of less than 3 nanometers. This is approximately 200 times flatter than conventional copper foil used in current AI accelerator substrates and is evaluated as a next-generation packaging material capable of simultaneously reducing signal loss and power consumption in high-speed, high-frequency environments.
The ultra-flat copper structure also has the advantage of enabling fine circuit pattern implementation and high-density wiring design, significantly increasing semiconductor package design flexibility. Additionally, it maintains stability without oxidation or delamination even in high-temperature environments above 250°C, making it suitable for high-heat AI semiconductor packages.
The company also differentiated itself in terms of process. By replacing existing multi-step plating and polishing processes with a single dry deposition process, it achieved both process simplification and carbon emission reduction. Through an eco-friendly process using recycled copper, carbon emissions can be reduced by up to 95% compared to conventional methods, drawing attention as a technology that meets the semiconductor industry's ESG (Environmental, Social, and Governance) requirements.
CIT's "CuFlat-PKGCore" previously won the CES 2026 Innovation Award, gaining recognition for its technological innovation and industrial applicability. Using this MWC participation as an opportunity, the company plans to accelerate expanding cooperation with global telecommunications, AI, and semiconductor companies and securing a foundation for commercialization.
CIT has been promoting exhibition and publicity, investment connections, and technology commercialization strategy advancement through stage-by-stage support from Busan Creative Economy Innovation Center, including the preliminary startup package, PIE batch program, Smart City Living Lab, BOUNCE super-gap accelerating, and global expansion support programs.
A Busan Creative Economy Innovation Center official said, "CIT is an advanced manufacturing deep tech startup possessing core material technology to respond to paradigm changes in AI semiconductor packaging, and this MWC public exhibition will be an opportunity to accelerate entry into the global market." The official added, "We will continue to expand global exhibition, investment, and commercialization support so that next-generation semiconductor and materials startups can secure competitiveness in the world market."