Hanmi Semiconductor Joins Micron's India Fab Opening as Key Partner

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By Seo Jong-gap
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Hanmi Semiconductor attends as 'key partner' for Micron's first fab in India - Seoul Economic Daily Finance News from South Korea
Hanmi Semiconductor attends as 'key partner' for Micron's first fab in India

Hanmi Semiconductor (042700) attended Micron Technology's inauguration ceremony for its first advanced semiconductor packaging facility in India as a key equipment partner. The participation reaffirms the Korean company's position in the global artificial intelligence chip supply chain.

Hanmi Semiconductor announced on the 3rd that it was invited to the opening ceremony held on September 28 at Micron's facility in Sanand, Gujarat, India.

Indian Prime Minister Narendra Modi attended the event and delivered commemorative remarks. Micron CEO Sanjay Mehrotra joined key officials from the Indian government and business leaders at the gathering. "We attended as one of Micron's most important equipment suppliers," a Hanmi Semiconductor official said.

The newly opened Micron India facility is an advanced packaging hub with total investment of $2.75 billion (approximately 4 trillion won). Spanning 500,000 square feet—equivalent to seven soccer fields—it houses the world's largest single-story cleanroom. The facility will serve as a key base for testing and packaging high-performance AI memory products, including stacked graphics DRAM (GDDR) and enterprise solid-state drives (eSSD).

The project was pursued as a national strategic initiative, with the Indian government providing 50% and Gujarat state contributing 20% in subsidies. It marks the first approved project under India's "Semicon India" policy, which allocates approximately $10 billion in subsidies. The facility is considered a milestone in India's ambition to become a global semiconductor manufacturing hub.

The Gujarat facility currently produces the latest DDR5 DRAM using Micron's cutting-edge 1-gamma process technology. Micron plans to begin packaging and testing tens of millions of chips this year, scaling up to hundreds of millions of units next year. Investment of 1 trillion to 2 trillion won is projected for advanced semiconductor packaging equipment, including TC bonders essential for AI memory chip stacking.

Precision bonding technology and rapid technical support are essential for stable yield and operations at the new facility. Hanmi Semiconductor, named Micron's "Top Supplier" last year, plans to maintain its long-term partnership by dispatching engineers on-site for hands-on technical support and operating training programs.

"Attending Micron's India factory opening ceremony reaffirms Hanmi Semiconductor's status as a key partner in the global semiconductor supply chain," a company official said. "We will maximize customer satisfaction through proactive technical support, including deploying engineers locally in India."

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AI-translated from Korean. Quotes from foreign sources are based on Korean-language reports and may not reflect exact original wording.