Samsung Electro-Mechanics (009150.KS) is securing additional global Big Tech clients with a turnkey solution that supplies semiconductor substrates and silicon capacitors (passive components) as a single package.
According to industry sources Friday, Samsung Electro-Mechanics has recently begun ramping up a "bundling" sales strategy for global Big Tech firms, combining multilayer ceramic capacitors (MLCC) and silicon capacitors (Si-Cap) with flip-chip ball grid arrays (FC-BGA).
"When we sell to global Big Tech, our package solutions division and the teams handling MLCC and Si-Cap participate as one team," a company official said. "This is to support technical consultations so that clients can choose the appropriate solution between MLCC and Si-Cap when designing AI chips."
Big Tech firms adopt MLCC, the existing mainstay component, when high voltage and large capacity are needed in AI chip design, and ultra-thin Si-Cap when space constraints are significant.
Samsung Electro-Mechanics' "three-pronged" bundling sales have already yielded results worth trillions of won. Last month, the company signed a 1.557 trillion won Si-Cap supply contract with one of the global Big Tech firms.
Currently, only three companies can supply Si-Cap — Samsung Electro-Mechanics, TSMC and Murata — leading the industry to expect that discussions on additional orders for Samsung Electro-Mechanics will gain momentum in the second half of the year. "There is a high likelihood of new Si-Cap-related orders over the next three to six months," an industry official said.
