Additional Investment in Onyang Campus... Expanding Back-End Processing Too

Pushing for expansion four times the size of a soccer field<br/>Advancing packaging, the core of fine processes<br/>Large-scale expansion also planned in Cheonan

Finance|
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By Reporter Kim Yoon-soo
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#SamsungElectronics#HBM#Semiconductors#AIMemory#ChipPackaging#Onyang#KoreaTech

AI-translated from Korean. Quotes from foreign sources are based on Korean-language reports and may not reflect exact original wording.

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