Hanmi Semiconductor (042700), which posted its best-ever results, has substantially increased its dividend. The payout for fiscal year 2025 totals 76 billion won ($52 million), up 11.3% from the previous year. This marks the largest dividend in the company's history.
Hanmi Semiconductor announced on the 4th that it will distribute 800 won per share, totaling 76 billion won, on the 7th of this month. The figure represents an 11.3% increase from the previous record of 68.3 billion won in 2024.
The record performance led to a substantially larger dividend. Hanmi Semiconductor achieved exceptionally high results for a components company last year, with revenue of 576.7 billion won and operating profit of 251.4 billion won (operating margin of 43.6%), thanks to its vertically integrated manufacturing system that internalizes all processes from casting to parts processing, software, assembly, and inspection. The company attributes its success to applying its "One Frame Body" method across all equipment, which minimizes vibration and enables precision manufacturing.
Hanmi Semiconductor aims to maintain its leadership in thermocompression (TC) bonders in the next-generation high-bandwidth memory (HBM) market. The company holds an overwhelming 71.2% market share in TC bonders. Following the launch of "TC Bonder 4" for sixth-generation HBM4 last year, the company will release its "Wide TC Bonder" targeting HBM5 and HBM6 production in the second half of this year. It is strengthening collaboration with global customers to launch an advanced hybrid bonder aligned with mass production of 16-layer or higher HBM by 2029.
The company is also accelerating its push into the high-value-added artificial intelligence (AI) packaging sector. It recently launched the world's first "BOC COB Bonder," which can perform both board-on-chip (BOC) and chip-on-board (COB) processes on a single machine, and supplied it to Micron's Gujarat plant in India. The company demonstrated its status as a key supplier by attending the opening ceremony of Micron's first factory in India on the 28th of last month. This year, it plans to aggressively target foundries and outsourced semiconductor assembly and test (OSAT) markets in the Greater China region with products including its "Big Die Flip Chip (FC) Bonder."
A Hanmi Semiconductor official emphasized, "Starting with this 76 billion won dividend, we will continue to expand our dividend payout ratio and devote all efforts to shareholder returns and enhancing corporate value."